Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract

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SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT

Organization Name

sk hynix inc.

Inventor(s)

Young Ock Hong of Icheon-si Gyeonggi-do (KR)

SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240159823 titled 'SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT

Simplified Explanation

The semiconductor device described in the abstract includes a defect detection circuit that is connected to a plurality of upper and lower bonding pads through lines. The defect detection circuit is designed to detect defects in the lower lines of the device.

  • The semiconductor device has a defect detection circuit for identifying defects in the lower lines of the device.
  • The defect detection circuit is connected to the lower lines of the device.
  • The upper bonding pads are connected to each other through a first upper line.
  • The lower bonding pads are connected to the lower lines.
  • The defect detection circuit has an input terminal connected to one lower line and an output terminal connected to another lower line.

Potential Applications

The technology described in this patent application could be applied in the semiconductor industry for improving the quality control of semiconductor devices by detecting defects in the lower lines.

Problems Solved

This technology helps in identifying defects in the lower lines of semiconductor devices, which can improve the overall reliability and performance of the devices.

Benefits

The use of a defect detection circuit in semiconductor devices can lead to higher quality products with fewer defects, ultimately increasing customer satisfaction and trust in the brand.

Potential Commercial Applications

"Improving Quality Control in Semiconductor Devices through Defect Detection Circuits"

Possible Prior Art

There may be prior art related to defect detection circuits in semiconductor devices, but specific examples are not provided in this context.

Unanswered Questions

How does the defect detection circuit differentiate between different types of defects in the lower lines of the semiconductor device?

The patent abstract does not provide details on how the defect detection circuit distinguishes between various types of defects in the lower lines.

What is the impact of the defect detection circuit on the overall cost of manufacturing semiconductor devices?

The abstract does not address the potential cost implications of implementing the defect detection circuit in semiconductor devices.


Original Abstract Submitted

there is provided a semiconductor device having a defect detection circuit. the semiconductor device includes a plurality of upper bonding pads, a plurality of lower bonding pads adhered to the plurality of upper bonding pads, a first upper line electrically connecting upper bonding pads, among the plurality of upper bonding pads, to each other; a plurality of lower lines electrically connected to the plurality of lower bonding pads; and a first defect detection circuit including an input terminal connected to a lower line, among the plurality of lower lines and an output terminal connected to another lower line, among the plurality of lower lines.