Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
Semiconductor Manufacturing International (Shanghai) Corporation Patent Filing Activity
Semiconductor Manufacturing International (Shanghai) Corporation patent applications in 2025
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Top 10 Technology Areas
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- H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups)
- H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate})
- H01L28/60 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/5223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
_Corporation_Top_Emerging_Technology_Areas_2025_-_Up_to_February_2025.png)
- H01L29/7851 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L29/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics})
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L21/28518 (from a gas or vapour, e.g. condensation)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L29/66515 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides)
- Count: 1 patents
- Example: 20250015162. SEMICONDUCTOR DEVICE (Semiconductor Manufacturing International (Shanghai) Corporation)
- H01L29/267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L29/1054 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components)
Top Inventors
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- Jisong JIN (4 patents)
- Fei ZHOU (1 patent)
- Abraham YOO (1 patent)
- Yang LIU (1 patent)
Patent Categories
_Corporation_Patent_Categories_2025_-_Up_to_February_2025.png)
Geographical Distribution of Inventors
_Corporation_Inventor_Countries_2025_-_Up_to_February_2025.png)
Geographical Distribution of US Inventors
_Corporation_Inventor_States_2025_-_Up_to_February_2025.png){kind=link}
Categories:
- Pages with broken file links
- Semiconductor Manufacturing International (Shanghai) Corporation
- Companies
- CPC H01L28/60
- CPC H01L23/5223
- CPC H01L25/18
- CPC H01L23/3135
- CPC H01L23/538
- CPC H01L24/16
- CPC H01L24/17
- CPC H01L24/73
- CPC H01L24/81
- CPC H10B80/00
- CPC H01L24/13
- CPC H01L24/32
- CPC H01L2224/13111
- CPC H01L2224/16146
- CPC H01L2224/16225
- CPC H01L2224/1703
- CPC H01L2224/32145
- CPC H01L2224/32225
- CPC H01L2224/73204
- CPC H01L2224/81005
- CPC H01L2224/81986
- CPC H01L2225/06513
- CPC H01L2225/06517
- CPC H01L2225/06541
- CPC H01L2924/1431
- CPC H01L2924/1436
- CPC H01L27/0922
- CPC H01L21/8221
- CPC H01L21/823814
- CPC H01L21/823871
- CPC H01L21/823878
- CPC H01L29/0673
- CPC H01L29/41733
- CPC H01L29/42392
- CPC H01L29/66439
- CPC H01L29/66545
- CPC H01L29/775
- CPC H01L29/78696
- CPC H01L21/76898
- CPC H01L23/5283
- CPC H01L23/5286
- CPC H01L24/08
- CPC H01L2224/08145
- CPC H01L2924/15165
- CPC H01L27/0886
- CPC H01L21/823431
- CPC H01L29/1054
- CPC H01L29/267
- CPC H01L29/66515
- CPC H01L21/28518
- CPC H01L21/76895
- CPC H01L23/535
- CPC H01L29/45
- CPC H01L29/66795
- CPC H01L29/7851
- Patent Trends by Company in 2025