Seiko epson corporation (20240312943). Channel Manufacturing Method simplified abstract
Contents
Channel Manufacturing Method
Organization Name
Inventor(s)
Junichi Okamoto of Shiojiri (JP)
Channel Manufacturing Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312943 titled 'Channel Manufacturing Method
The abstract describes a method for manufacturing a channel by forming a slit and a recess on a substrate, transferring adhesive to the substrate, and bonding another substrate to it.
- First forming step involves creating a slit and a recess on the first surface of the first substrate.
- First transfer step includes applying adhesive to the first substrate for later use.
- First bonding step involves attaching a second substrate to the first substrate using the adhesive.
Potential Applications: - This method can be used in the manufacturing of microfluidic devices. - It can also be applied in the production of electronic components requiring precise bonding.
Problems Solved: - Enables the creation of channels with precise dimensions. - Facilitates the bonding of substrates with high accuracy.
Benefits: - Improved accuracy in channel manufacturing. - Enhanced bonding strength between substrates.
Commercial Applications: Title: Advanced Channel Manufacturing Method for Microfluidic Devices This technology can be utilized in the production of microfluidic devices for medical diagnostics, drug delivery systems, and chemical analysis. The precise channel formation and bonding process can lead to more reliable and efficient devices in various industries.
Questions about Channel Manufacturing Method: 1. How does this method improve the accuracy of channel manufacturing? This method allows for the precise formation of slits and recesses on substrates, ensuring accurate dimensions for the channels.
2. What are the potential applications of this manufacturing method? This method can be applied in various industries such as healthcare, electronics, and research for creating microfluidic devices and electronic components with high precision.
Original Abstract Submitted
there is provided a channel manufacturing method for performing a first forming step of forming, on a first surface of a first substrate, a slit and a first recess to be separated from each other, a first transfer step of transferring a first adhesive applied to a first substrate for application to the first surface of the first substrate, and a first bonding step of bonding a second substrate to the first surface of the first substrate via the first adhesive.
