Seiko epson corporation (20240213952). RESONATOR DEVICE simplified abstract
Contents
RESONATOR DEVICE
Organization Name
Inventor(s)
Yukihiro Hashi of Shiojiri-shi (JP)
Junichi Takeuchi of Chino-shi (JP)
Tomoyuki Kamakura of Matsumoto-shi (JP)
RESONATOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213952 titled 'RESONATOR DEVICE
The patent application describes a resonator device that includes a base substrate, a resonator element, a mounting terminal, and a metal bump.
- The base substrate has a first surface and a second surface, with the resonator element located on the first surface side.
- The resonator element consists of a resonator substrate and an electrode terminal on the base-substrate-side surface.
- A mounting terminal is disposed at the first surface, and a metal bump is placed between the base substrate and the resonator element to bond them together.
- The metal bump also electrically couples the mounting terminal and the electrode terminal.
- The cross-sectional area of the metal bump at the bonding portion with the resonator element is crucial, being 491 μm or more and 4007 μm or less.
Potential Applications: - This technology can be used in various electronic devices requiring precise resonator elements. - It can be applied in telecommunications, sensors, and frequency control devices.
Problems Solved: - Ensures a secure bond between the base substrate and the resonator element. - Provides a reliable electrical connection between the mounting terminal and the electrode terminal.
Benefits: - Improved performance and stability of resonator devices. - Enhanced durability and longevity of electronic components.
Commercial Applications: - This technology can be utilized in the manufacturing of smartphones, GPS devices, and wireless communication systems. - It has implications in the consumer electronics industry, particularly in improving signal processing and frequency control.
Questions about the Technology: 1. How does the metal bump contribute to the overall functionality of the resonator device? 2. What are the key factors to consider when optimizing the cross-sectional area of the metal bump for bonding purposes?
Original Abstract Submitted
a resonator device includes: a base substrate having a first surface and a second surface in a front-to-back relationship with the first surface; a resonator element located on a first surface side of the base substrate and including a resonator substrate and an electrode terminal disposed at a base-substrate-side surface of the resonator substrate; a mounting terminal disposed at the first surface; and a metal bump disposed between the base substrate and the resonator element, the metal bump being configured to bond the base substrate and the resonator element and electrically couple the mounting terminal and the electrode terminal. a cross-sectional area of the metal bump at a bonding portion with the resonator element is 491 �mor more and 4007 �mor less.
