Seiko epson corporation (20240109321). LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS simplified abstract

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LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

Organization Name

seiko epson corporation

Inventor(s)

Fumiya Takino of SHIOJIRI-SHI (JP)

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240109321 titled 'LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

Simplified Explanation

The abstract describes a patent application for a head chip with nozzles for ejecting liquid, an adhesive for bonding the chip to another member, and a heating element for plasticizing the adhesive.

  • Head chip with nozzle plate containing multiple nozzles for liquid ejection
  • Adhesive used to bond head chip to another member
  • Heating element to melt adhesive for bonding
  • Technology for precise liquid dispensing applications

Potential Applications

The technology could be used in various industries such as 3D printing, medical devices, and electronics manufacturing for precise liquid dispensing tasks.

Problems Solved

This technology solves the problem of securely bonding a head chip with nozzles to another member while ensuring precise liquid dispensing without leakage.

Benefits

The benefits of this technology include improved accuracy and efficiency in liquid dispensing processes, leading to higher quality end products.

Potential Commercial Applications

The technology could be commercialized for use in industries requiring precise liquid dispensing, such as pharmaceuticals, biotechnology, and microelectronics, under the title "Precision Liquid Dispensing Technology for Industrial Applications."

Possible Prior Art

One possible prior art could be similar technologies used in inkjet printers or industrial dispensing systems.

Unanswered Questions

How does this technology compare to existing liquid dispensing systems on the market?

This article does not provide a direct comparison to existing liquid dispensing systems, leaving the reader to wonder about the competitive advantages of this technology.

What are the specific industries that could benefit most from this technology?

While the article mentions some potential applications, it does not delve into the specific industries that could see the most significant impact from implementing this technology.


Original Abstract Submitted

a head chip that includes a nozzle plate having a plurality of nozzles configure to eject a liquid, another member different from the head chip, an adhesive that bonds the head chip and the other member, and a heating element configured to plasticize the adhesive are provided.