Samsung sdi co., ltd. (20240319601). METHOD OF FORMING PATTERNS simplified abstract
Contents
METHOD OF FORMING PATTERNS
Organization Name
Inventor(s)
Hyungrang Moon of Suwon-si (KR)
Youngkwon Kim of Suwon-si (KR)
METHOD OF FORMING PATTERNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319601 titled 'METHOD OF FORMING PATTERNS
The method described in the patent application involves coating a metal-containing resist composition on a substrate, followed by coating a composition for removing edge beads along the edge of the substrate. The coated resultant is then dried and heated to form a metal-containing resist film on the substrate. Subsequently, the dried and heated resultant is exposed and developed to form a resist pattern.
- Coating a metal-containing resist composition on a substrate
- Coating a composition for removing edge beads along the edge of the substrate
- Drying and heating the coated resultant to form a metal-containing resist film on the substrate
- Exposing and developing the dried and heated resultant to form a resist pattern
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Photolithography processes
Problems Solved: - Improved precision in resist patterning - Enhanced edge bead removal - Efficient resist film formation
Benefits: - Higher quality resist patterns - Increased productivity in manufacturing processes - Cost-effective solution for microfabrication
Commercial Applications: Title: Advanced Resist Patterning Method for Semiconductor Manufacturing This technology can be utilized in the semiconductor industry for producing intricate patterns on substrates, leading to enhanced performance and efficiency in electronic devices. The market implications include improved product quality, reduced production costs, and increased competitiveness in the semiconductor market.
Questions about the technology: 1. How does this method compare to traditional resist patterning techniques? 2. What are the potential environmental impacts of using this technology in semiconductor manufacturing processes?
Frequently Updated Research: Researchers are continuously exploring new materials and methods to further improve resist patterning techniques in semiconductor manufacturing. Stay updated on the latest advancements in this field to enhance production processes and product quality.
Original Abstract Submitted
provided is a method of forming patterns that includes coating a metal-containing resist composition on a substrate; coating a composition for removing edge beads along the edge of the substrate; drying and heating the coated resultant to form a metal-containing resist film on the substrate; and exposing and developing the dried and heated resultant to form a resist pattern,
