Samsung electronics co., ltd. (20250087541). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250087541 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a package substrate that extends in a first direction, an interposer on an upper surface of the package substrate, where the interposer includes: a first substrate that includes a first portion having a first thickness in a second direction that is perpendicular to the first direction and a second portion having a second thickness in the second direction that is greater than the first thickness, and a plurality of first through vias that extend into the first substrate, a photonic ic chip on the first portion of the first substrate, where the photonic ic chip includes: a second substrate, a front insulation layer, an optical waveguide, an optical fiber, and a coupler, and a plurality of semiconductor chips on the second portion of the interposer.