Samsung electronics co., ltd. (20250070079). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
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MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
YongChul Shin of Suwon-si (KR)
Kyeongbin Lim of Suwon-si (KR)
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250070079 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.
