Samsung electronics co., ltd. (20250062237). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunsoo Chung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062237 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
provided is a semiconductor package including a first redistribution layer, a first semiconductor chip disposed on the first redistribution layer, a circuit board disposed between the first redistribution layer and the first semiconductor chip, bonding wires connecting the first semiconductor chip and the circuit board to each other, a second redistribution layer disposed on the first semiconductor chip, a second semiconductor chip disposed on the second redistribution layer, and conductive posts connecting the first redistribution layer and the second redistribution layer to each other.