Samsung electronics co., ltd. (20250022837). WIRE BONDING APPARATUS
WIRE BONDING APPARATUS
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WIRE BONDING APPARATUS
This abstract first appeared for US patent application 20250022837 titled 'WIRE BONDING APPARATUS
Original Abstract Submitted
a wire bonding apparatus may include a bonder and a common loader/unloader. the bonder may bond a conductive wire to a plurality of package substrates. the common loader/unloader may load the package substrates into the bonder. the common loader/unloader may unload the package substrates from the bonder. thus, an occupying area of the wire bonding apparatus in semiconductor fabrication equipment may be reduced to improve a productivity of the semiconductor fabrication equipment.