Samsung electronics co., ltd. (20250006582). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250006582 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a semiconductor package is provided. the semiconductor package includes: a redistribution substrate; a first semiconductor chip provided on a right portion, in a first direction, of the redistribution substrate; a through-post provided on the redistribution substrate in a region adjacent to a left side, in the first direction, of the first semiconductor chip; a heat dissipation chip provided on the first semiconductor chip; and a second semiconductor device provided adjacent to the heat dissipation chip on the through-post. a metal pad and an adhesive layer are provided between the heat dissipation chip and the first semiconductor chip.