Samsung electronics co., ltd. (20240355666). SUBSTRATE TRANSFERRING APPARATUS simplified abstract

SUBSTRATE TRANSFERRING APPARATUS

Organization Name

samsung electronics co., ltd.

Inventor(s)

Sung-Il Choi of Suwon-si (KR)

Seong-Eun Kang of Suwon-si (KR)

Kyung Beom Kim of Suwon-si (KR)

Sung Yoon Ryu of Suwon-si (KR)

Mi Ra Park of Suwon-si (KR)

Yong Kyu Lee of Suwon-si (KR)

Jeung Hee Lee of Suwon-si (KR)

Ju Hyun Lee of Suwon-si (KR)

Nam Young Cho of Suwon-si (KR)

SUBSTRATE TRANSFERRING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355666 titled 'SUBSTRATE TRANSFERRING APPARATUS

The patent application describes a substrate transferring apparatus that includes a support plate with an upper surface for holding a substrate, and a vacuum pad that can be attached to the support plate to suction the substrate in place.

• The vacuum pad has a suction area and a support protrusion surrounding it, with the upper surface of the support protrusion higher than the suction area to support the substrate securely.
• The upper surface of the support protrusion is inclined relative to horizontal, providing additional stability for the substrate during transfer.

Potential Applications: - This technology can be used in semiconductor manufacturing processes where precise handling of substrates is crucial. - It can also be applied in the production of electronic devices, such as flat panel displays, to ensure accurate positioning of substrates.

Problems Solved: - Ensures secure fixation of substrates during transfer, reducing the risk of damage or misalignment. - Provides stability and support for delicate substrates, improving overall manufacturing efficiency.

Benefits: - Enhanced precision and accuracy in substrate handling. - Increased productivity and reduced material wastage due to improved substrate stability.

Commercial Applications: - This technology can be utilized in cleanroom environments for semiconductor fabrication. - It can also be integrated into automated production lines for electronic device manufacturing.

Questions about the Technology: 1. How does the inclined upper surface of the support protrusion contribute to the stability of the substrate during transfer? 2. What are the potential cost savings associated with using this substrate transferring apparatus in manufacturing processes?

Frequently Updated Research: - Stay updated on advancements in vacuum pad technology and substrate handling methods to enhance the efficiency and effectiveness of the apparatus.

Original Abstract Submitted

a substrate transferring apparatus includes a support plate including an upper surface on which a substrate is configured to be seated, and a vacuum pad detachably coupled to the support plate and configured to vacuum suction the substrate to fix the substrate on the upper surface of the support plate, wherein the vacuum pad includes a suction area and a support protrusion surrounding the suction area, an upper surface of the support protrusion is at a higher vertical level than an upper surface of the suction area to support the substrate, and the upper surface of the support protrusion is inclined relative to horizontal.