Samsung electronics co., ltd. (20240355583). PLASMA PROCESSING APPARATUS simplified abstract
Contents
PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Naohiko Okunishi of Suwon-si (KR)
Hyeong Mo Kang of Suwon-si (KR)
Seong Sik Nam of Suwon-si (KR)
Seung Bo Shim of Suwon-si (KR)
PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355583 titled 'PLASMA PROCESSING APPARATUS
Simplified Explanation: The patent application describes a plasma processing apparatus with a variable impedance controller on the shower head to control impedance by changing contact points between two rotating members.
- The apparatus includes a shower head with an electrode and a variable impedance controller.
- The variable impedance controller consists of two members, one fixed and one rotating, to adjust impedance.
- Impedance is controlled by changing contact points between the two members as the rotating member moves.
Key Features and Innovation:
- Variable impedance controller on the shower head.
- Two rotating members to adjust impedance.
- Control of impedance by changing contact points.
Potential Applications:
- Semiconductor manufacturing.
- Thin film deposition.
- Surface cleaning processes.
Problems Solved:
- Precise control of impedance in plasma processing.
- Enhanced efficiency and accuracy in semiconductor manufacturing.
- Improved quality of thin film deposition.
Benefits:
- Increased control over plasma processing.
- Higher quality and efficiency in manufacturing processes.
- Cost-effective solution for impedance control.
Commercial Applications: Plasma processing equipment with variable impedance control can be used in semiconductor fabrication facilities, research laboratories, and industrial manufacturing plants. This technology can improve the quality and efficiency of various processes, leading to cost savings and enhanced product performance.
Questions about Plasma Processing Apparatus: 1. How does the variable impedance controller improve the efficiency of plasma processing? 2. What are the potential cost savings associated with using this technology in semiconductor manufacturing?
Original Abstract Submitted
a plasma processing apparatus comprises a shower head configured to receive an electrode therein, and a variable impedance controller on the shower head. the variable impedance controller includes a first member spaced apart from the shower head and arranged along a circumference of the shower head, and a second member on the first member and configured to rotate. the variable impedance controller is configured to control an impedance by changing the impedance resulting from the first member and the second member as at least one contact point between the first member and the second member is changed according to rotation of the second member.
