Samsung electronics co., ltd. (20240347498). MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract
Contents
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
Organization Name
Inventor(s)
Sangwook Park of Suwon-si (KR)
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347498 titled 'MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
The memory device described in the patent application includes a semiconductor substrate with wire bonding pads arranged in a first direction, signal redistribution patterns connecting wire bonding pads to signal via pads on one side, and power redistribution patterns connected to wire bonding pads on the other side.
- The memory device features wire bonding pads, signal redistribution patterns, and power redistribution patterns on a semiconductor substrate.
- Signal redistribution patterns connect wire bonding pads to signal via pads on one side of the substrate.
- Power redistribution patterns connect wire bonding pads to power sources on the other side of the substrate.
- The wire bonding pads, signal redistribution patterns, and power redistribution patterns are arranged in different directions on the semiconductor substrate.
- The design allows for efficient signal and power distribution within the memory device.
Potential Applications: - Memory devices in electronic devices - Integrated circuits - Data storage systems
Problems Solved: - Efficient signal and power distribution in memory devices - Improved performance and reliability of memory systems
Benefits: - Enhanced functionality of memory devices - Increased data processing speed - Reduced power consumption
Commercial Applications: Title: Advanced Memory Devices for High-Performance Electronics This technology can be used in various electronic devices, such as smartphones, computers, and servers, to improve memory performance and efficiency. The market implications include faster data processing, longer battery life, and enhanced overall device performance.
Questions about the technology: 1. How does the design of the memory device contribute to improved signal and power distribution? 2. What are the potential market opportunities for memory devices with enhanced signal and power distribution capabilities?
Original Abstract Submitted
a memory device comprising: a semiconductor substrate; a plurality of wire bonding pads on the semiconductor substrate and arranged in a first direction; a plurality of signal redistribution patterns connecting first wire bonding pads among the plurality of wire bonding pads to a plurality of signal via pads, respectively, wherein the plurality of signal redistribution patterns are on a first side with respect to the plurality of wire bonding pads in a second direction that is perpendicular to the first direction; and a plurality of power redistribution patterns connected to second wire bonding pads among the plurality of wire bonding pads, respectively, wherein the plurality of power redistribution patterns are on a second side with respect to the plurality of wire bonding pads in the second direction, wherein the first and second directions are parallel with an upper surface of the semiconductor substrate.
