Samsung electronics co., ltd. (20240347409). SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
Organization Name
Inventor(s)
Seokkyu Choi of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347409 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER
Simplified Explanation: The semiconductor package described in the patent application includes various layers such as a connection layer, a semiconductor chip, an adhesive layer, a heat spreader layer, and a lower redistribution layer. The dimensions of these layers are carefully designed to optimize the performance of the semiconductor package.
- The semiconductor chip is positioned at the center of the connection layer.
- An adhesive layer is placed on top of the semiconductor chip.
- A heat spreader layer is then added on top of the adhesive layer.
- The lower redistribution layer is located on the connection layer and the bottom surface of the semiconductor chip.
- The width of the adhesive layer matches the width of the semiconductor chip, while the heat spreader layer is narrower than the adhesive layer.
Key Features and Innovation:
- Central placement of the semiconductor chip within the connection layer.
- Use of an adhesive layer to secure the semiconductor chip.
- Incorporation of a heat spreader layer for thermal management.
- Lower redistribution layer for enhanced connectivity.
- Optimization of layer widths for improved performance.
Potential Applications: The technology described in the patent application could be applied in various semiconductor packaging applications, including consumer electronics, automotive systems, and industrial equipment.
Problems Solved: This technology addresses issues related to thermal management, connectivity, and overall performance optimization in semiconductor packaging.
Benefits:
- Improved thermal performance.
- Enhanced connectivity.
- Optimal performance of semiconductor chips.
- Increased reliability and longevity of semiconductor packages.
Commercial Applications: The technology has potential commercial applications in industries such as consumer electronics, automotive manufacturing, and industrial automation. It could be used to enhance the performance and reliability of semiconductor devices in these sectors.
Questions about Semiconductor Packaging: 1. How does the width of the adhesive layer impact the performance of the semiconductor package? 2. What are the advantages of positioning the semiconductor chip at the center of the connection layer?
Frequently Updated Research: Researchers are constantly exploring new materials and designs to further improve the thermal management and performance of semiconductor packages. Stay updated on the latest advancements in this field to ensure optimal results in semiconductor packaging applications.
Original Abstract Submitted
a semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. a width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.
