Samsung electronics co., ltd. (20240339468). SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD simplified abstract
Contents
SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD
Organization Name
Inventor(s)
SUN KYOUNG Seo of CHEONAN-SI (KR)
YONG HOE Cho of CHEONAN-SI (KR)
SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339468 titled 'SEMICONDUCTOR PACKAGE WITH PROTECTIVE MOLD
Simplified Explanation: The method described in the patent application involves fabricating a semiconductor package by cutting a wafer to form a transparent substrate, mounting an image sensor chip on the substrate, and forming a mold layer over the chip.
- The method includes partially cutting a wafer to create a transparent substrate with two parts of different widths.
- An image sensor chip with specific layers and electrodes is mounted on the substrate.
- A mold layer is formed over the transparent substrate and the image sensor chip.
- Connection terminals are added to the image sensor chip.
- The transparent substrate and mold layer are cut along the boundary of the unit wafer.
Key Features and Innovation:
- Partial cutting of the wafer to create a transparent substrate with varying widths.
- Mounting an image sensor chip with specific layers and electrodes on the substrate.
- Forming a mold layer over the transparent substrate and image sensor chip.
- Adding connection terminals to the image sensor chip.
- Precise cutting of the transparent substrate and mold layer along the wafer boundary.
Potential Applications: The technology can be used in the manufacturing of semiconductor packages for various electronic devices such as cameras, smartphones, and other imaging devices.
Problems Solved: This technology addresses the need for precise fabrication of semiconductor packages with image sensor chips, ensuring proper functionality and durability of electronic devices.
Benefits:
- Improved manufacturing process for semiconductor packages.
- Enhanced performance and reliability of electronic devices.
- Cost-effective production of image sensor chips.
Commercial Applications: The technology can be utilized in the consumer electronics industry for the production of high-quality cameras, smartphones, and other imaging devices, enhancing their performance and durability.
Questions about Semiconductor Package Fabrication: 1. How does the method of partially cutting the wafer contribute to the fabrication process? 2. What are the specific layers and electrodes present in the image sensor chip?
2. Another relevant generic question, with a detailed answer.
Original Abstract Submitted
provided is a method for fabricating a semiconductor package. the method includes partially cutting a wafer along a boundary of a unit wafer to form a transparent substrate including a first part having a first width and a second part and mounting an image sensor chip on the second part of the transparent substrate. the image sensor chip includes a redistribution insulation layer, a redistribution layer in the redistribution insulation layer, a first substrate layer on the redistribution insulation layer, and a penetration electrode penetrating the first substrate layer and electrically connecting the redistribution layer. the method further includes forming a mold layer on the transparent substrate, covering side surfaces of the second part and side surfaces of the image sensor chip, forming a connection terminal on the image sensor chip, and cutting the transparent substrate and the mold layer along the boundary of the unit wafer.
