Samsung electronics co., ltd. (20240332221). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungyoung Ahn of Daejeon (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332221 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a package substrate, an interposer die, semiconductor chips, and connection bumps. The interposer die has spiral matching structures, while the package substrate has trace-shaped matching structures.
- Package includes a package substrate, interposer die, semiconductor chips, and connection bumps.
- Interposer die has spiral matching structures, and the package substrate has trace-shaped matching structures.
- First connection bumps connect semiconductor chips to the interposer die.
- Second connection bumps connect the interposer die to the package substrate.
- Third connection bumps are located below the package substrate.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a reliable and efficient way to connect semiconductor chips to the package substrate. - Enhances the overall performance and functionality of electronic devices.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced durability and reliability of semiconductor packages. - Enables higher processing speeds and data transfer rates.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized by semiconductor manufacturers to produce high-performance electronic devices with improved reliability and efficiency. It can cater to a wide range of industries, including consumer electronics, automotive, healthcare, and telecommunications.
Questions about Semiconductor Packaging Technology: 1. How does the spiral matching structure in the interposer die enhance the performance of the semiconductor package? 2. What are the specific advantages of using trace-shaped matching structures in the package substrate for semiconductor packaging?
Original Abstract Submitted
a semiconductor package includes a package substrate, an interposer die disposed on the package substrate, semiconductor chips disposed on the interposer die and electrically connected to the package substrate via the interposer die, first connection bumps electrically connecting the semiconductor chips to the interposer die, second connection bumps electrically connecting the interposer die to the package substrate, and third connection bumps disposed below the package substrate, wherein the interposer die includes spiral matching structures adjacent to upper portions of the second connection bumps, and the package substrate includes trace-shaped matching structures adjacent to lower portions of the second connection bumps.
