Samsung electronics co., ltd. (20240321914). COMPOUND, PHOTOELECTRIC DEVICE, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE simplified abstract

COMPOUND, PHOTOELECTRIC DEVICE, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Tae Jin Choi of Suwon-si (KR)

Hyeong-Ju Kim of Suwon-si (KR)

Daiki Minami of Suwon-si (KR)

Kyung Bae Park of Suwon-si (KR)

Jeong Il Park of Suwon-si (KR)

Hiromasa Shibuya of Suwon-si (KR)

Jeoung In Yi of Suwon-si (KR)

Younhee Lim of Suwon-si (KR)

Hyerim Hong of Suwon-si (KR)

COMPOUND, PHOTOELECTRIC DEVICE, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321914 titled 'COMPOUND, PHOTOELECTRIC DEVICE, LIGHT ABSORPTION SENSOR, SENSOR-EMBEDDED DISPLAY PANEL, AND ELECTRONIC DEVICE

Simplified Explanation: The patent application describes a compound with a molecular packing density of at least 1.55 molecules/nm, and its applications in photoelectric devices, light absorption sensors, sensor-embedded display panels, and electronic devices.

Key Features and Innovation:

• Compound with high molecular packing density
• Suitable for use in various electronic devices and sensors

Potential Applications: The technology can be used in:

• Photoelectric devices
• Light absorption sensors
• Sensor-embedded display panels
• Electronic devices

Problems Solved: The technology addresses the need for compounds with high molecular packing density for efficient electronic devices and sensors.

Benefits:

• Improved performance in electronic devices
• Enhanced sensitivity in sensors
• Increased efficiency in light absorption

Commercial Applications: Potential commercial uses include:

• Manufacturing of advanced electronic devices
• Production of high-performance sensors
• Integration into display panels for improved functionality

Questions about the Technology: 1. How does the molecular packing density of the compound impact its performance in electronic devices and sensors? 2. What specific characteristics make this compound suitable for use in photoelectric devices and light absorption sensors?

Frequently Updated Research: Stay updated on the latest advancements in compounds with high molecular packing density for electronic applications to ensure the technology remains competitive in the market.

Original Abstract Submitted

provided is a compound represented by any one of chemical formulas 1 to 3, and having a molecular packing density of greater than or equal to about 1.55 molecules/nmand photoelectric devices, light absorption sensors, sensor-embedded display panels, and electronic devices including the same.