Samsung electronics co., ltd. (20240321857). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Juhyeon Kim of Cheonan-si (KR)
Sunkyoung Seo of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321857 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The method of manufacturing a semiconductor package involves attaching a lower semiconductor chip to a wafer structure, forming bonding pads, and creating a second semiconductor substrate by removing a portion of the preliminary semiconductor substrate.
- Wafer structure prepared with first semiconductor substrate and first front surface connection pads
- Lower semiconductor chip attached to wafer structure with second front surface connection pads
- Bonding pads formed by bonding first and second front surface connection pads
- Second semiconductor substrate created by removing part of preliminary semiconductor substrate
- Second semiconductor substrate has horizontal width less than second wiring structure
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing - Integrated circuit production
Problems Solved: - Efficient semiconductor package manufacturing process - Improved connectivity between semiconductor substrates
Benefits: - Enhanced performance of semiconductor packages - Cost-effective manufacturing process
Commercial Applications: Title: Semiconductor Package Manufacturing Method This technology can be used in the semiconductor packaging industry to streamline production processes and improve the quality of semiconductor packages. It can also benefit electronics manufacturers looking to enhance the performance of their products.
Prior Art: Readers can explore prior art related to semiconductor packaging methods, wafer bonding techniques, and semiconductor substrate manufacturing processes to gain a deeper understanding of the technology.
Frequently Updated Research: Researchers are constantly exploring new methods and materials to further improve semiconductor packaging techniques and enhance the performance of electronic devices.
Questions about Semiconductor Package Manufacturing Method: 1. How does this method compare to traditional semiconductor packaging techniques? This method offers a more efficient and cost-effective approach to semiconductor package manufacturing compared to traditional methods. By forming bonding pads between front surface connection pads, it improves connectivity and overall performance.
2. What are the potential challenges in implementing this manufacturing method on a larger scale? Scaling up this manufacturing method may require additional equipment and resources to ensure consistent quality and efficiency. Companies may need to invest in specialized tools and training to fully adopt this technology.
Original Abstract Submitted
a method of manufacturing a semiconductor package includes preparing a wafer structure having a first semiconductor substrate and a plurality of first front surface connection pads. a lower semiconductor chip having a preliminary semiconductor substrate and a plurality of second front surface connection pads are attached to the wafer structure such that the plurality of first front surface connection pads and the plurality of second front surface connection pads correspond to each other. a plurality of bonding pads is formed by bonding together the plurality of first front surface connection pads and the plurality of second front surface connection pads corresponding to each other. a second semiconductor substrate having a horizontal width that is less than that of the second wiring structure is formed by removing a portion of the preliminary semiconductor substrate.
