Samsung electronics co., ltd. (20240321847). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321847 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a first substrate, a first chip structure, a second chip structure, an underfill material layer, and a first protrusion.
- The first chip structure is positioned above the first substrate in a vertical direction.
- The second chip structure is located above the first substrate and is spaced apart from the first chip structure in a horizontal direction perpendicular to the vertical direction.
- An underfill material layer is placed between the second chip structure and the first substrate.
- A first protrusion extends from the first substrate in the vertical direction and extends in a horizontal direction perpendicular to the vertical direction along at least one side surface of the underfill material layer, with a side surface of the first protrusion making contact with the underfill material layer.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the reliability and performance of semiconductor devices in industries such as telecommunications, automotive, and consumer electronics.
Problems Solved: - Enhances the structural integrity of semiconductor packages. - Improves thermal management and electrical performance of semiconductor devices.
Benefits: - Increased reliability and durability of semiconductor packages. - Enhanced thermal dissipation capabilities. - Improved electrical connectivity and signal transmission.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, laptops, and IoT devices. It can also benefit industries requiring robust and efficient semiconductor solutions.
Questions about the technology: 1. How does the first protrusion improve the overall performance of the semiconductor package? 2. What are the specific advantages of using an underfill material layer in semiconductor packaging?
Original Abstract Submitted
a semiconductor package includes a first substrate; a first chip structure disposed above the first substrate in a vertical direction; a second chip structure disposed above the first substrate and spaced apart from the first chip structure in a first horizontal direction perpendicular to the vertical direction; an underfill material layer disposed between the second chip structure and the first substrate; and a first protrusion extending from the first substrate in the vertical direction and extending in a second horizontal direction perpendicular to the vertical direction and the first horizontal direction along at least one side surface of the underfill material layer, where a side surface of the first protrusion contacts the underfill material layer.
