Samsung electronics co., ltd. (20240321841). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321841 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first wiring structure with a first wiring, a first semiconductor chip, a molding member, a second wiring structure with a second wiring and a heat conductive metal, a second semiconductor chip, first bumps, an underfill layer, and a first thermal interface material (TIM).
- First wiring structure with first wiring
- First semiconductor chip on the first wiring structure
- Molding member surrounding the first semiconductor chip
- Second wiring structure on the molding member with second wiring and heat conductive metal
- Second semiconductor chip on the second wiring structure
- First bumps between the second wiring structure and the second semiconductor chip
- Underfill layer covering the first bumps
- First thermal interface material (TIM) on the heat conductive metal
Potential Applications: - Advanced electronic devices - High-performance computing systems - Aerospace and defense technology
Problems Solved: - Improved thermal management in semiconductor packages - Enhanced performance and reliability of electronic devices
Benefits: - Better heat dissipation capabilities - Increased efficiency and longevity of electronic components - Enhanced overall performance of electronic systems
Commercial Applications: Title: "Innovative Semiconductor Package for Enhanced Thermal Management" This technology can be utilized in various industries such as consumer electronics, automotive, telecommunications, and medical devices. It can significantly improve the performance and reliability of electronic products in these sectors.
Questions about the technology: 1. How does the heat conductive metal in the second wiring structure contribute to thermal management? 2. What are the key advantages of using first bumps between the second wiring structure and the second semiconductor chip?
Original Abstract Submitted
the disclosure provides a semiconductor package including a first wiring structure including a first wiring, a first semiconductor chip on the first wiring structure, a molding member surrounding the first semiconductor chip, a second wiring structure on an upper surface of the molding member and including a second wiring and a heat conductive metal, a second semiconductor chip on an upper surface of the second wiring structure, a plurality of first bumps between the second wiring structure and the second semiconductor chip, an underfill layer covering the plurality of first bumps, and a first thermal interface material (tim) on an upper surface of the heat conductive metal, the heat conductive metal not overlapping the plurality of first bumps in the vertical direction.
