Samsung electronics co., ltd. (20240321826). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Dongchul Yang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321826 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The semiconductor package described in the patent application consists of multiple components, including redistribution substrates, semiconductor chips, inter-substrate through-electrodes, and a heat dissipation structure.
- The package includes a first redistribution substrate, on which a first semiconductor chip is mounted.
- A second redistribution substrate is placed on top of the first semiconductor chip.
- Inter-substrate through-electrodes are located on one side of the first semiconductor chip, connecting the first redistribution substrate to the second redistribution substrate.
- A second semiconductor chip is mounted on top of the first semiconductor chip.
- A heat dissipation structure is positioned on the second semiconductor chip.
Potential Applications: - This technology can be used in various electronic devices that require efficient heat dissipation and compact packaging. - It can be applied in high-performance computing systems, mobile devices, and automotive electronics.
Problems Solved: - Addresses the need for improved thermal management in semiconductor packages. - Provides a solution for reducing the size and weight of electronic devices while maintaining performance.
Benefits: - Enhanced thermal performance and reliability of semiconductor packages. - Compact design allows for more efficient use of space in electronic devices. - Improved overall performance and longevity of electronic systems.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Thermal Management This technology can be utilized in the development of high-performance computers, smartphones, tablets, and automotive electronics. The compact design and efficient heat dissipation capabilities make it ideal for applications where space is limited and thermal management is crucial.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve thermal management in electronic devices? - This technology enhances thermal management by incorporating a heat dissipation structure and efficient inter-substrate through-electrodes to dissipate heat effectively. 2. What are the potential commercial applications of this semiconductor packaging technology? - The technology can be applied in various electronic devices such as high-performance computers, smartphones, tablets, and automotive electronics, where efficient heat dissipation and compact design are essential.
Original Abstract Submitted
a semiconductor package includes a first redistribution substrate; a first semiconductor chip on the first redistribution substrate; a second redistribution substrate on the first semiconductor chip; inter-substrate through-electrodes on the first redistribution substrate at one side of the first semiconductor chip and connecting the first redistribution substrate to the second redistribution substrate; a second semiconductor chip on the first semiconductor chip; and a heat dissipation structure on the second semiconductor chip.
