Samsung electronics co., ltd. (20240321794). SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP simplified abstract
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321794 titled 'SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP
The semiconductor chip described in the patent application consists of a semiconductor substrate, a pad insulating layer on the substrate, a through electrode that goes through the substrate and the pad insulating layer, a conductive plug, and a conductive barrier layer surrounding the conductive plug's sidewall, and a bonding pad surrounding the through electrode's sidewall.
- The semiconductor chip includes a through electrode with a conductive plug and a conductive barrier layer, enhancing electrical conductivity.
- The bonding pad is spaced apart from the conductive plug with the conductive barrier layer in between, ensuring proper insulation and preventing electrical interference.
- The design of the through electrode and bonding pad allows for efficient electrical connections within the semiconductor chip.
- The conductive barrier layer surrounding the conductive plug's sidewall provides protection against external factors that could potentially damage the chip.
- Overall, the semiconductor chip's structure improves performance and reliability in electronic devices.
Potential Applications: This technology can be applied in various electronic devices such as smartphones, computers, and IoT devices where efficient electrical connections are crucial.
Problems Solved: This technology addresses issues related to electrical conductivity, insulation, and protection in semiconductor chips, ensuring optimal performance and reliability.
Benefits: Improved electrical conductivity, enhanced insulation, increased protection, and overall better performance and reliability in electronic devices utilizing this semiconductor chip technology.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Electrical Connectivity This technology can be utilized in the manufacturing of smartphones, computers, IoT devices, and other electronic products, enhancing their performance and reliability in the market.
Questions about Semiconductor Chip Technology: 1. How does the conductive barrier layer in the through electrode contribute to the chip's performance?
- The conductive barrier layer provides protection against external factors and enhances the chip's reliability.
2. What are the potential commercial applications of this semiconductor chip technology?
- This technology can be applied in various electronic devices to improve their electrical connectivity and overall performance.
Original Abstract Submitted
a semiconductor chip includes: a semiconductor substrate; a pad insulating layer on the semiconductor substrate; a through electrode which penetrates the semiconductor substrate and the pad insulating layer and includes a conductive plug and a conductive barrier layer surrounding a sidewall of the conductive plug; and a bonding pad which surrounds a sidewall of the through electrode and is spaced apart from the conductive plug with the conductive barrier layer disposed therebetween.
