Samsung electronics co., ltd. (20240321792). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321792 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a semiconductor chip, a pad structure connected to the chip, a solder ball in contact with the pad structure, and an insulating layer between the chip and the pad structure.
- The insulating layer features a ring-shaped groove surrounding the pad structure, spaced apart from it.
- The solder ball is positioned in a first direction away from the semiconductor chip.
- The pad structure is electrically connected to the semiconductor chip.
- The insulating layer ensures proper insulation between the chip and the pad structure.
- The ring-shaped groove enhances the structural integrity of the package.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, industrial machinery, and medical devices.
Problems Solved: - Provides insulation to prevent electrical interference. - Ensures proper electrical connection between the chip and the pad structure. - Enhances the reliability and durability of the semiconductor package.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced structural integrity of semiconductor packages. - Increased efficiency in electronic circuitry.
Commercial Applications: - This technology can be utilized by semiconductor manufacturers, electronic device manufacturers, and other industries requiring reliable electronic components. - It has the potential to impact the market by offering more robust and efficient semiconductor packages.
Questions about the Semiconductor Package: 1. How does the ring-shaped groove in the insulating layer contribute to the overall design of the semiconductor package? 2. What are the specific advantages of having the solder ball spaced apart from the semiconductor chip in a first direction?
Original Abstract Submitted
provided is a semiconductor package including a semiconductor chip, a pad structure electrically connected to the semiconductor chip, a solder ball spaced apart from the semiconductor chip in a first direction and in contact with the pad structure, and an insulating layer arranged between the semiconductor chip and the pad structure and in contact with the pad structure, wherein the insulating layer includes a first ring-shaped groove having a ring shape surrounding the pad structure, and the first ring-shaped groove is spaced apart from the pad structure.
