Samsung electronics co., ltd. (20240321775). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunggil Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321775 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first package substrate with a semiconductor device mounted on one surface and connected to the substrate. The package also features connection pads on the opposite surface, external connection terminals on some of these pads, passive elements mounted on other pads without external terminals, and a floating structure positioned between a passive element and an external connection terminal.
- The semiconductor package includes a unique floating structure that separates passive elements and external connection terminals.
- The package design allows for efficient and effective connection of the semiconductor device to external systems.
- By strategically placing passive elements and external connection terminals, the package optimizes space utilization and functionality.
- The floating structure enhances the reliability and performance of the semiconductor package.
- This innovation offers a novel approach to semiconductor packaging, improving overall product quality and functionality.
Potential Applications: - Integrated circuits - Electronic devices - Communication systems
Problems Solved: - Efficient connection of semiconductor devices - Space optimization in semiconductor packaging - Enhanced reliability and performance
Benefits: - Improved functionality of semiconductor packages - Enhanced reliability and performance - Optimal use of space in packaging design
Commercial Applications: Title: Innovative Semiconductor Packaging Technology for Enhanced Performance This technology can be applied in various industries such as consumer electronics, telecommunications, and automotive sectors. It can improve the efficiency and reliability of electronic devices, leading to better overall performance and customer satisfaction.
Questions about Semiconductor Packaging: 1. How does the floating structure in the semiconductor package improve performance? The floating structure in the semiconductor package enhances reliability by separating passive elements and external connection terminals, reducing interference and optimizing signal transmission. 2. What are the potential applications of this innovative semiconductor packaging technology? This technology can be used in a wide range of electronic devices, communication systems, and integrated circuits to improve functionality and reliability.
Original Abstract Submitted
a semiconductor package comprises: a first package substrate; a semiconductor device mounted on a first surface of the first package substrate and connected to the first package substrate; a plurality of connection pads on a second surface of the first package substrate; a plurality of external connection terminals respectively disposed on one or more connection pads of the plurality of connection pads; a plurality of passive elements mounted on one or more connection pads of the plurality of connection pads in which the plurality of external connection terminals are not disposed; and a floating structure disposed between at least one passive element from the plurality of passive elements and at least one external connection terminal from the plurality of external connection terminals, spaced apart from the at least one passive element and the at least one external connection terminal, and disposed on the second surface of the first package substrate.
