Samsung electronics co., ltd. (20240321753). PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Okgyeong Park of Suwon-si (KR)
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321753 titled 'PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The patent application describes a package substrate that includes a core substrate with first and second surfaces, a first core laminated structure on the first surface, a bridge chip within a chip mounting space defined by the first core insulating layers, and a second core laminated structure on the second surface.
- The package substrate consists of a core substrate with two surfaces, a first core laminated structure on the first surface, and a second core laminated structure on the second surface.
- The first core laminated structure includes insulating layers and wiring layers, with a chip mounting space for a bridge chip.
- The bridge chip within the chip mounting space comprises a bridge substrate and a bridge pad.
- The second core laminated structure also includes insulating layers and wiring layers, with a coefficient of thermal expansion lower than that of the first core insulating layers.
Potential Applications: - This technology could be used in electronic devices such as smartphones, tablets, and laptops. - It may find applications in the automotive industry for advanced driver assistance systems (ADAS) and infotainment systems.
Problems Solved: - Provides a structure that can accommodate different coefficients of thermal expansion, reducing the risk of damage due to temperature changes. - Offers a compact design for integrating chips within the substrate, saving space in electronic devices.
Benefits: - Improved reliability and durability of electronic devices. - Enhanced thermal performance and longevity of the package substrate. - Cost-effective manufacturing process for electronic components.
Commercial Applications: - The technology could be utilized by semiconductor manufacturers, electronics companies, and automotive suppliers for various products and systems.
Questions about the technology: 1. How does the package substrate's design contribute to the overall reliability of electronic devices? 2. What are the specific advantages of having a bridge chip within the chip mounting space in the first core laminated structure?
Original Abstract Submitted
a package substrate may include a core substrate including a first surface and a second surface, a first core laminated structure on the first surface of the core substrate, including first core insulating layers and first cores wiring layers on the first core insulating layers, and including a first chip mounting space defined by the first core insulating layers, a bridge chip within the first chip mounting space and including a bridge substrate and a bridge pad, and a second core laminated structure on the second surface of the core substrate, and including second core insulating layers and second core wiring layers on the second core insulating layers, wherein the first core insulating layers have a first coefficient of thermal expansion, and the second core insulating layers have a second coefficient of thermal expansion less than the first coefficient of thermal expansion.
