Samsung electronics co., ltd. (20240321744). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321744 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure pertains to semiconductor packages. An example semiconductor package comprises a substrate with an active surface and an inactive surface, multiple wiring structures on the active surface, an inter-wiring insulating layer covering the wiring structures, a modified layer with carbonized material on both side surfaces covered by the insulating layer, and a passivation layer on top.
- Substrate with active and inactive surfaces
- Wiring structures on the active surface
- Inter-wiring insulating layer covering the wiring structures
- Modified layer with carbonized material on side surfaces
- Passivation layer on top
Potential Applications: - Semiconductor industry - Electronics manufacturing
Problems Solved: - Enhanced protection for wiring structures - Improved performance and durability of semiconductor packages
Benefits: - Increased reliability - Better thermal management - Extended lifespan of semiconductor devices
Commercial Applications: - Integrated circuits - Microprocessors - Memory modules
Questions about Semiconductor Packages: 1. How does the modified layer with carbonized material contribute to the performance of the semiconductor package?
The carbonized material in the modified layer enhances the protection and durability of the wiring structures, improving overall performance.
2. What are the key advantages of using an inter-wiring insulating layer in semiconductor packages?
The inter-wiring insulating layer helps prevent short circuits and interference between the wiring structures, leading to more reliable devices.
Original Abstract Submitted
the present disclosure relates to semiconductor packages. an example semiconductor package includes a substrate including an active surface and an inactive surface, a plurality of wiring structures arranged on the active surface of the substrate, an inter-wiring insulating layer arranged on the active surface of the substrate and configured to cover the plurality of wiring structures, a modified layer including both side surfaces thereof covered by the inter-wiring insulating layer and including a carbonized material, and a passivation layer arranged on the inter-wiring insulating layer and the modified layer.
