Samsung electronics co., ltd. (20240321690). INTEGRATED CIRCUIT DEVICE simplified abstract
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INTEGRATED CIRCUIT DEVICE
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INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321690 titled 'INTEGRATED CIRCUIT DEVICE
The abstract describes an integrated circuit device with a substrate, an insulating structure on the frontside surface of the substrate, a contact structure with a first plug portion extending through the substrate, and a self-assembled organic material insulating liner between the first plug portion and the substrate.
- The integrated circuit device includes a substrate with an insulating structure on the frontside surface.
- It features a contact structure with a first plug portion that extends through the substrate.
- A self-assembled organic material insulating liner is present between the first plug portion and the substrate.
Potential Applications: - This technology can be used in the manufacturing of advanced integrated circuits. - It may find applications in the semiconductor industry for improving device performance.
Problems Solved: - Enhances the insulation and connectivity within integrated circuit devices. - Improves the overall reliability and efficiency of the circuit components.
Benefits: - Increased performance and reliability of integrated circuits. - Enhanced insulation properties for better functionality.
Commercial Applications: Title: Advanced Integrated Circuit Technology for Improved Performance This technology can be utilized in the production of high-performance electronic devices, leading to better efficiency and reliability in various industries such as telecommunications, computing, and consumer electronics.
Questions about Integrated Circuit Device Technology: 1. How does the self-assembled organic material insulating liner improve the performance of the integrated circuit device? - The organic material insulating liner enhances insulation and connectivity, leading to improved overall reliability and efficiency of the circuit components.
2. What are the potential applications of this technology in the semiconductor industry? - This technology can be applied in the semiconductor industry to enhance device performance and reliability, particularly in the manufacturing of advanced integrated circuits.
Original Abstract Submitted
an integrated circuit device includes a substrate, an insulating structure on a frontside surface of the substrate, a contact structure including a first plug portion that extends through the substrate, and a self-assembled organic material insulating liner between the first plug portion and the substrate.
