Samsung electronics co., ltd. (20240321682). HEAT DISSIPATION STRUCTURES simplified abstract
Contents
- 1 HEAT DISSIPATION STRUCTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT DISSIPATION STRUCTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Semiconductor Package with Heat Dissipation Structure
- 1.11 Original Abstract Submitted
HEAT DISSIPATION STRUCTURES
Organization Name
Inventor(s)
Youngjoon Koh of Suwon-si (KR)
HEAT DISSIPATION STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321682 titled 'HEAT DISSIPATION STRUCTURES
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate, a semiconductor device mounted on the substrate, and a heat dissipation structure with multiple vapor chambers and heat pipes.
- The semiconductor package has a unique heat dissipation structure with multiple vapor chambers and heat pipes.
- The vapor chambers are positioned at different levels in the vertical direction to efficiently dissipate heat.
- Heat pipes extend between the vapor chambers to further enhance heat dissipation.
Key Features and Innovation
- Semiconductor package with a heat dissipation structure comprising vapor chambers and heat pipes.
- Vapor chambers at different levels in the vertical direction for effective heat dissipation.
- Heat pipes connecting the vapor chambers to improve thermal management.
Potential Applications
The technology can be applied in various electronic devices requiring efficient heat dissipation, such as high-performance computers, servers, and mobile devices.
Problems Solved
- Improved thermal management in semiconductor packages.
- Enhanced heat dissipation capabilities for electronic devices.
- Efficient cooling solution for high-power applications.
Benefits
- Increased reliability and performance of electronic devices.
- Extended lifespan of semiconductor components.
- Reduced risk of overheating and damage.
Commercial Applications
- Semiconductor Industry
The technology can be utilized in the semiconductor industry to enhance the thermal management of electronic devices, leading to improved performance and reliability.
Questions about Semiconductor Package with Heat Dissipation Structure
What are the key components of the heat dissipation structure in the semiconductor package?
The key components include vapor chambers positioned at different levels in the vertical direction and heat pipes that connect these chambers for efficient heat dissipation.
How does the heat dissipation structure improve the performance of electronic devices?
By effectively dissipating heat generated by semiconductor components, the heat dissipation structure helps maintain optimal operating temperatures, leading to improved performance and reliability.
Original Abstract Submitted
provided is a semiconductor package including a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device, wherein the heat dissipation structure includes a plurality of vapor chambers at different levels in the vertical direction and a plurality of heat pipes extending between the plurality of vapor chambers.
