Samsung electronics co., ltd. (20240321680). SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract
Contents
SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE
Organization Name
Inventor(s)
Sungchan Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321680 titled 'SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE
The semiconductor device described in the patent application includes a semiconductor chip, a cooling channel for coolant flow and heat absorption, and a wick structure for moving the coolant along the channel.
- The semiconductor device features a cooling channel that allows liquid coolant to flow and absorb heat from the semiconductor chip.
- A wick structure generates capillary force to move the coolant in liquid phase along the wall surface of the cooling channel.
- The wick structure includes a suspended wick structure that is separated from the wall surface by a capillary distance.
Potential Applications: - This technology can be applied in high-performance computing systems. - It can also be used in data centers to improve cooling efficiency. - The semiconductor device could find applications in automotive electronics for thermal management.
Problems Solved: - Addresses the issue of heat dissipation in semiconductor devices. - Improves overall performance and reliability of electronic systems. - Enhances thermal management in compact electronic devices.
Benefits: - Efficient cooling of semiconductor chips. - Increased longevity and reliability of electronic systems. - Improved overall performance of electronic devices.
Commercial Applications: Title: Advanced Thermal Management Solutions for Electronic Devices This technology can be commercialized for use in: - High-performance computing systems - Data centers - Automotive electronics industry
Questions about the Technology: 1. How does the wick structure improve the cooling efficiency of the semiconductor device?
- The wick structure generates capillary force to move the coolant along the cooling channel, enhancing heat dissipation.
2. What are the potential long-term benefits of implementing this semiconductor device in electronic systems?
- The long-term benefits include improved performance, reliability, and longevity of electronic devices.
Original Abstract Submitted
a semiconductor device includes: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel. the wick structure includes a suspended wick structure that is disposed apart from the wall surface by a capillary distance.
