Samsung electronics co., ltd. (20240321483). WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract
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WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR
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WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321483 titled 'WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR
- Simplified Explanation:**
The patent application describes a wire structure with a metal layer, a dielectric layer, and a filling material that is more flexible than the dielectric layer.
- Key Features and Innovation:**
- Wire structure with metal layer, dielectric layer, and flexible filling material
- Filling material has higher flexibility than dielectric layer
- Potential Applications:**
- Electronics industry for flexible wiring
- Aerospace industry for lightweight wiring solutions
- Problems Solved:**
- Increased flexibility in wire structures
- Improved durability and performance in wiring applications
- Benefits:**
- Enhanced flexibility for better performance
- Lightweight and durable wiring solutions
- Commercial Applications:**
- Title: Flexible Wire Structures for Advanced Electronics
- Potential commercial uses in electronics, aerospace, and other industries
- Market implications include improved product performance and durability
- Questions about Wire Structures:**
1. What are the key components of a wire structure?
- A wire structure typically consists of a metal layer, a dielectric layer, and a filling material.
2. How does the flexibility of the filling material impact the overall performance of the wire structure?
- The flexibility of the filling material is crucial for ensuring the wire structure can bend and adapt to different applications.
Original Abstract Submitted
a wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.
