Samsung electronics co., ltd. (20240319229). WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF simplified abstract
Contents
WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF
Organization Name
Inventor(s)
Chunghyun Kim of Suwon-si (KR)
Cheolkyu Lim of Cheonan-si (KR)
Byungwook Jeong of Cheonan-si (KR)
WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319229 titled 'WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF
The abstract describes a wafer testing apparatus that includes a probe board, a wafer chuck, a camera, and a controller. The probe board is positioned above a chamber, while the wafer chuck is located below the probe board to support the wafer. The camera captures images of probe imaging points on the probe board and wafer imaging points on the wafer. The controller adjusts the tilt of the probe board based on the image information acquired by the camera.
- The probe board is positioned above a chamber.
- The wafer chuck supports the wafer below the probe board.
- The camera captures images of probe and wafer imaging points.
- The controller adjusts the tilt of the probe board based on image information.
- Probe imaging points are arranged in a rhombic pattern on the probe board.
- Wafer imaging points are arranged in a rhombic pattern on the wafer.
Potential Applications: - Semiconductor wafer testing - Quality control in semiconductor manufacturing
Problems Solved: - Accurate alignment of probe and wafer imaging points - Efficient testing of semiconductor wafers
Benefits: - Improved accuracy in wafer testing - Increased efficiency in semiconductor manufacturing processes
Commercial Applications: Title: Semiconductor Wafer Testing Apparatus for Improved Quality Control This technology can be used in semiconductor manufacturing facilities to enhance the quality control process, ensuring accurate testing of semiconductor wafers and improving overall production efficiency.
Questions about Wafer Testing Apparatus: 1. How does the camera adjust the tilt of the probe board? The controller adjusts the tilt of the probe board based on image information acquired by the camera. 2. What is the significance of arranging imaging points in a rhombic pattern? Arranging imaging points in a rhombic pattern helps in accurate alignment and testing of semiconductor wafers.
Original Abstract Submitted
a wafer testing apparatus includes a probe board disposed above a chamber, a wafer chuck disposed below the probe board and configured to support the wafer, a camera located between the probe board and the wafer chuck and configured to capture images of probe imaging points arranged on a lower surface of the probe board and wafer imaging points arranged on an upper surface of the wafer, and a controller electrically connected to the camera and configured to adjust a tilt of the probe board on the basis of image information acquired by the camera. the probe imaging points include a plurality of probe outer imaging points arranged in a rhombic pattern on the lower surface of the probe board, and the wafer imaging points include a plurality of wafer outer imaging points arranged in a rhombic pattern on the upper surface of the wafer.
