Samsung electronics co., ltd. (20240318314). SUBSTRATE SUPPORT DEVICE simplified abstract
Contents
SUBSTRATE SUPPORT DEVICE
Organization Name
Inventor(s)
SUBSTRATE SUPPORT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240318314 titled 'SUBSTRATE SUPPORT DEVICE
Simplified Explanation:
The patent application describes a substrate support device with a chuck plate, a shaft, a heater unit, an electrode unit, a jumper unit, and a power control unit.
- The chuck plate holds the substrate in place.
- The shaft is connected to the center of the chuck plate.
- The heater unit and electrode unit are inside the chuck plate.
- The jumper unit supplies power to the electrode unit.
- The electrode unit consists of a center electrode and a ring-shaped first electrode.
- The jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode.
Key Features and Innovation:
- Chuck plate for substrate support.
- Shaft connected to the center of the chuck plate.
- Heater unit and electrode unit inside the chuck plate.
- Jumper unit supplying power to the electrode unit.
- Center electrode and ring-shaped first electrode in the electrode unit.
- First jumper and center jumper in the jumper unit.
Potential Applications:
The technology can be used in semiconductor manufacturing, thin film deposition, and other industries requiring precise substrate heating and control.
Problems Solved:
The device addresses the need for uniform heating of substrates, precise control of temperature, and efficient power supply to the electrode unit.
Benefits:
- Improved substrate heating.
- Enhanced temperature control.
- Efficient power supply.
- Increased productivity in manufacturing processes.
Commercial Applications:
The technology can be applied in semiconductor fabrication, solar panel production, and LED manufacturing, leading to more efficient and reliable processes.
Prior Art:
Readers can explore prior patents related to substrate support devices, chuck plates, and electrode units in semiconductor manufacturing.
Frequently Updated Research:
Stay updated on advancements in substrate support technology, materials science, and semiconductor manufacturing processes.
Questions about Substrate Support Devices: 1. What are the key components of a substrate support device? 2. How does the jumper unit contribute to the functionality of the device?
Original Abstract Submitted
a substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.
