Samsung electronics co., ltd. (20240312959). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
DOOHWAN Lee of CHEONAN-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312959 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a frame with a through-opening, two semiconductor chips stacked on top of each other, connection pads on the active surfaces of the chips, bumps and posts for electrical connections, and a connection member with a redistribution layer.
- The semiconductor package consists of a frame, two stacked semiconductor chips, connection pads, bumps, posts, and a connection member.
- The first and second semiconductor chips have active surfaces with connection pads and inactive surfaces.
- Bumps are electrically connected to the connection pads on each chip.
- Dummy bumps are placed at the same level as the bumps for structural support.
- Posts are electrically connected to the bumps for further connections.
- A connection member with a redistribution layer is electrically connected to the posts.
- A dummy post is positioned between the frame and the connection member for additional support.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a compact and efficient way to stack and connect multiple semiconductor chips in a package. - Ensures reliable electrical connections between the chips and external components. - Enhances the structural integrity of the semiconductor package.
Benefits: - Improved performance and functionality of electronic devices. - Cost-effective manufacturing process for semiconductor packages. - Enhanced durability and reliability of the overall system.
Commercial Applications: - The semiconductor package can be utilized by semiconductor manufacturers, electronics companies, and technology firms. - It can cater to the growing demand for smaller and more powerful electronic devices in the market.
Questions about Semiconductor Package Technology: 1. How does the placement of dummy bumps contribute to the overall structure of the semiconductor package? 2. What are the specific advantages of using posts for electrical connections in this semiconductor package design?
Original Abstract Submitted
a semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.
