Samsung electronics co., ltd. (20240290812). IMAGE SENSOR simplified abstract
Contents
IMAGE SENSOR
Organization Name
Inventor(s)
SEUNGKUK Kang of Suwon-si (KR)
IMAGE SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290812 titled 'IMAGE SENSOR
The abstract describes an image sensor with a circuit chip and an image sensor chip. The image sensor chip has a first substrate, a first interlayer dielectric layer, and a first bonding pad. The circuit chip includes a second substrate, a second interlayer dielectric layer, and a second bonding pad.
- The image sensor chip and circuit chip are in contact with each other.
- The second width of the second bonding pad changes more along a third direction than the first width of the first bonding pad.
- The third direction intersects the first and second directions.
Potential Applications: - This technology can be used in digital cameras, smartphones, and other devices that require image sensors. - It can also be applied in medical imaging equipment, security cameras, and automotive cameras.
Problems Solved: - Provides a compact and efficient design for image sensors. - Enhances the performance and functionality of image sensor devices.
Benefits: - Improved image quality and resolution. - Increased reliability and durability of image sensor components. - Cost-effective manufacturing process for image sensor chips.
Commercial Applications: Title: Innovative Image Sensor Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry for the development of high-quality cameras and imaging devices. It can also benefit the medical imaging sector by improving diagnostic equipment and enhancing patient care.
Questions about Image Sensor Technology: 1. How does this technology improve the overall performance of image sensors? - This technology enhances image quality, resolution, and reliability in various devices, leading to better user experiences. 2. What are the potential cost savings associated with implementing this innovative image sensor technology? - The efficient design and manufacturing process of this technology can lead to cost savings for companies producing image sensor devices.
Original Abstract Submitted
an image sensor comprising a circuit chip and an image sensor chip on the circuit chip. the image sensor chip includes a first substrate extending in a first direction and a second direction, a first interlayer dielectric layer between the first substrate and the circuit chip, and a first bonding pad in the first interlayer dielectric layer and having a first width in a first direction. the circuit chip includes a second substrate, a second interlayer dielectric layer and a third interlayer dielectric layer that are sequentially stacked on the second substrate, and a second bonding pad in the second and third interlayer dielectric layers and having a second width in the first direction. the first and second bonding pads are in contact with each other. a change in the second width along a third direction is greater than a change in the first width along the third direction, the third direction intersects the first and second directions.
