Samsung electronics co., ltd. (20240290762). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
CHOONGBIN Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290762 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of multiple layers and components that work together to enhance the performance and functionality of the semiconductor chips within the package.
- The package includes a first redistribution substrate, a connection substrate, a chip structure with a semiconductor chip, a first interposer substrate with a through electrode, a second semiconductor chip, a first molding layer, and a second redistribution substrate.
- The connection substrate has an opening through which the first semiconductor chip is placed, and the first interposer substrate is positioned between the chip structure and the second semiconductor chip.
- The through electrode on the first interposer substrate allows for electrical connection between the first and second semiconductor chips.
- The first molding layer covers the chip structure, first interposer substrate, and second semiconductor chip for protection and stability.
- The second redistribution substrate is placed on top of the first molding layer and connection substrate, ensuring electrical contact between the lower surface of the chip structure and the first interposer substrate with the upper surface of the first redistribution substrate.
Potential Applications: - This technology can be applied in advanced electronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Enhances the electrical connections and performance of semiconductor chips in a compact package. - Provides improved protection and stability for the semiconductor components.
Benefits: - Increased efficiency and reliability of electronic devices. - Enables higher performance capabilities in a smaller form factor. - Enhances overall durability and longevity of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized by semiconductor manufacturers to create high-performance electronic devices with improved reliability and compact designs. The market implications include the potential for increased demand for advanced semiconductor packaging solutions in various industries.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the electrical connections between semiconductor chips? 2. What are the key advantages of using a multi-layered semiconductor package like the one described in the patent application?
Original Abstract Submitted
a semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate, wherein the connection substrate includes an opening extending through the connection substrate, a chip structure including a first semiconductor chip in the opening and on the first redistribution substrate, a first interposer substrate including a through electrode extending through the first interposer substrate in the opening and on the first redistribution substrate, wherein the first interposer substrate is spaced apart from the chip structure, a second semiconductor chip on the first interposer substrate and electrically connected to the through electrode, a first molding layer on the chip structure, first interposer substrate, and second semiconductor chip, and a second redistribution substrate on the first molding layer and connection substrate, wherein a lower surface of the chip structure and the first interposer substrate are in electrical contact with an upper surface of the first redistribution substrate.
