Samsung electronics co., ltd. (20240290751). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Bongken Yu of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290751 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a package substrate, a logic chip connected to the package substrate, a heat sink to dissipate heat from the logic chip, and a memory chip connected to the package substrate.
- Package includes a package substrate, logic chip, heat sink, and memory chip.
- Logic chip is on the upper surface of the package substrate and electrically connected to it.
- Heat sink contacts the upper surface of the logic chip to dissipate heat generated by the chip.
- Memory chip is placed on the upper surface of the heat sink and electrically connected to the package substrate.
Potential Applications: - This technology can be used in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved: - Addresses the issue of heat generation in logic chips, which can affect the performance and longevity of electronic devices.
Benefits: - Improved thermal management leads to better overall performance and reliability of electronic devices. - Enhanced efficiency and longevity of logic chips and memory chips.
Commercial Applications: - This technology can be utilized in the manufacturing of consumer electronics, data centers, and industrial equipment to improve thermal management and overall performance.
Questions about Semiconductor Package: 1. How does the heat sink help dissipate heat from the logic chip?
- The heat sink contacts the upper surface of the logic chip to absorb and dissipate the heat generated by the chip.
2. What are the potential drawbacks of using a heat sink in a semiconductor package?
- While heat sinks are effective at dissipating heat, they can add bulk and weight to the overall package design.
Original Abstract Submitted
a semiconductor package includes a package substrate, a logic chip on an upper surface of the package substrate and electrically connected to the package substrate, a heat sink contacting an upper surface of the logic chip to dissipate a heat generating from the logic chip, and a memory chip disposed on an upper surface of the heat sink and electrically connected to the package substrate.
