Samsung electronics co., ltd. (20240290750). SEMICONDUCTOR PACKAGES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Potential Applications
- 1.5 Problems Solved
- 1.6 Benefits
- 1.7 Commercial Applications
- 1.8 Prior Art
- 1.9 Frequently Updated Research
- 1.10 Questions about Semiconductor Packaging Technology
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Hyunggil Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290750 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the patent application includes a substrate with a recess in one region and a separate region without the recess. A 3D integrated circuit structure is located on the region with the recess, consisting of two semiconductor chip dies stacked on top of each other. Connecting members electrically link the top chip die to the substrate, with one side touching the chip die and the other side touching the substrate. Additionally, a memory structure is placed in the region without the recess, next to the 3D integrated circuit structure.
- The semiconductor package features a unique design with a recess in one region of the substrate.
- The 3D integrated circuit structure includes two stacked semiconductor chip dies for enhanced performance.
- Connecting members directly link the top chip die to the substrate for efficient electrical connections.
- The memory structure is positioned alongside the 3D integrated circuit structure for optimized space utilization.
- This innovation allows for compact and efficient semiconductor packaging solutions.
Potential Applications
The technology described in the patent application could be applied in various electronic devices requiring high-performance semiconductor packages, such as smartphones, tablets, and computers.
Problems Solved
This technology addresses the need for compact and efficient semiconductor packaging solutions that can accommodate multiple chip dies in a limited space.
Benefits
The benefits of this technology include improved performance, space efficiency, and enhanced electrical connections in semiconductor packages.
Commercial Applications
Title: Innovative Semiconductor Packaging Technology for Enhanced Performance This technology could be commercially utilized in the consumer electronics industry to improve the performance and efficiency of electronic devices.
Prior Art
Further research can be conducted in the field of semiconductor packaging technologies to explore similar innovations and advancements.
Frequently Updated Research
Stay updated on the latest developments in semiconductor packaging technologies to leverage new advancements and improvements in the industry.
Questions about Semiconductor Packaging Technology
1. What are the potential challenges in implementing this innovative semiconductor packaging technology? 2. How does this technology compare to existing semiconductor packaging solutions in terms of performance and efficiency?
Original Abstract Submitted
a semiconductor package includes a substrate including a first region having a recess defined therein and a second region spaced apart from the first region. the second region does not include the recess. a three-dimensional (3d) integrated circuit structure is on the first region. the 3d integrated circuit structure includes a first semiconductor chip die and a second semiconductor chip die disposed on the first semiconductor chip die. a plurality of connecting members electrically connecting the first semiconductor chip die to the substrate. a first side of each connecting member of the plurality of connecting members directly contacts the first semiconductor chip die and a second side that is opposite to the first side directly contacts the first region. a memory structure is disposed in the second region and positioned side by side with the 3d integrated circuit structure.
