Samsung electronics co., ltd. (20240282790). IMAGE SENSOR PACKAGE simplified abstract
Contents
IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
Dong Hoon Kang of Hwaseong-si (KR)
IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282790 titled 'IMAGE SENSOR PACKAGE
The image sensor package described in the patent application consists of several layers and components, including a solder resist layer, redistribution layer, connection pad, mold layer, logic chip, image sensor chip, transparent substrate, and adhesive layer.
- The package includes a solder resist layer that wraps around a redistribution layer and a connection pad.
- A mold layer is situated on top of the solder resist layer, with an inner wall defining a sensor array region.
- A logic chip is placed on the solder resist layer within the sensor array region, making contact with the mold layer.
- An image sensor chip is then placed on top of the logic chip within the sensor array region, also contacting the mold layer.
- A transparent substrate is positioned at a distance from the image sensor chip in one direction.
- An adhesive layer is placed between the transparent substrate and the mold layer to secure them together.
Potential Applications: - This technology can be used in digital cameras, smartphones, and other devices that require image sensors. - It can also be applied in medical imaging equipment, surveillance cameras, and automotive cameras.
Problems Solved: - The package provides a secure and efficient way to house and protect image sensor components. - It ensures proper alignment and connection between the various layers and chips within the package.
Benefits: - Improved durability and reliability of image sensor packages. - Enhanced performance and image quality in devices utilizing this technology.
Commercial Applications: - Manufacturers of digital cameras, smartphones, medical equipment, and surveillance systems can benefit from incorporating this advanced image sensor package technology into their products.
Questions about the Image Sensor Package Technology: 1. How does the mold layer contribute to the overall functionality of the image sensor package? 2. What are the specific advantages of using a transparent substrate in this technology?
Frequently Updated Research: - Stay updated on advancements in image sensor technology, particularly in the development of more compact and efficient sensor packages.
Original Abstract Submitted
an image sensor package includes: a solder resist layer wrapping a redistribution layer and a connection pad; a mold layer on the solder resist layer and including an inner wall and an opposing outer wall, the inner wall defining a sensor array region; a logic chip on the solder resist layer and in the sensor array region, and contacting the mold layer; an image sensor chip on the logic chip and in the sensor array region, and contacting the mold layer; a transparent substrate spaced apart from the image sensor chip in a first direction; and an adhesive layer disposed between the transparent substrate and the mold layer. the mold layer includes a third face and a fourth face opposite to each other and connecting the inner wall and the outer wall. the fourth face of the mold layer does not overlap the image sensor chip in the first direction.
