Samsung electronics co., ltd. (20240282750). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEOKBEOM Yong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282750 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate, an upper chip, a passive element chip, and a lower chip. The passive element chip is positioned between the upper chip and the package substrate, with a through electrode connecting it to the lower chip. The passive element chip contains multiple passive elements on the through electrode, and its upper surface is in contact with the lower surface of the upper chip.
- The semiconductor package includes a package substrate, upper chip, passive element chip, and lower chip.
- The passive element chip features a through electrode that connects it to the lower chip.
- Multiple passive elements are present on the through electrode of the passive element chip.
- The upper surface of the passive element chip is in contact with the lower surface of the upper chip.
Potential Applications: - This technology can be utilized in the manufacturing of advanced semiconductor devices. - It can be applied in the development of high-performance electronic components. - The semiconductor package could find use in various industries requiring compact and efficient electronic systems.
Problems Solved: - Enhances the integration and performance of semiconductor components. - Provides a more efficient and reliable connection between chips. - Enables the creation of smaller and more powerful electronic devices.
Benefits: - Improved overall performance of semiconductor packages. - Enhanced reliability and durability of electronic systems. - Enables the development of more compact and advanced electronic devices.
Commercial Applications: Title: Advanced Semiconductor Package Technology for Enhanced Electronic Systems This technology can be commercialized in the semiconductor industry for the production of high-performance electronic devices. It has the potential to revolutionize the design and functionality of various electronic systems, leading to more efficient and reliable products in the market.
Questions about Semiconductor Package Technology: 1. How does the through electrode in the passive element chip improve the performance of the semiconductor package? 2. What are the specific advantages of having multiple passive elements on the through electrode in the semiconductor package?
Original Abstract Submitted
a semiconductor package including a package substrate; an upper chip on the package substrate; a passive element chip between the upper chip and the package substrate; and a lower chip between the passive element chip and the package substrate, wherein the passive element chip includes a through electrode connected to the lower chip; and a plurality of passive elements on the through electrode, and the upper surface of the passive element chip is in contact with the lower surface of the upper chip.
