Samsung electronics co., ltd. (20240278437). SUBSTRATE PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Hyeon Dong Song of Suwon-si (KR)
Jun Young Moon of Suwon-si (KR)
Sang Woo Park of Suwon-si (KR)
Hyun Soo Chun of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240278437 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with robot arms and an alignment jig for wafer handling and positioning.
- The substrate processing apparatus has a body with upper and side faces, robot arms on the upper face for wafer gripping, and an alignment jig for sensing robot arm positions.
- The alignment jig includes a horizontal frame on the body's upper face, a vertical frame on the side faces, and a displacement sensor to sense robot arm coordinates.
- The displacement sensor has two sensors spaced apart from the robot arms in a third direction and at a higher vertical level than the robot arms.
Potential Applications:
- Semiconductor manufacturing
- Wafer processing industries
- Automated assembly lines
Problems Solved:
- Precise wafer handling and positioning
- Efficient substrate processing
- Enhanced automation in manufacturing processes
Benefits:
- Improved accuracy in wafer handling
- Increased productivity in substrate processing
- Streamlined manufacturing operations
Commercial Applications:
- Semiconductor fabrication facilities
- Electronics manufacturing plants
- Research and development laboratories
Questions about the technology: 1. How does the alignment jig improve the efficiency of substrate processing? 2. What are the advantages of using robot arms in wafer handling operations?
Frequently Updated Research: There may be ongoing research in the field of robotics and automation to further enhance the capabilities of substrate processing apparatus like the one described in the patent application.
Original Abstract Submitted
a substrate processing apparatus includes a body which includes an upper face and side faces, and extends in a first direction, a plurality of robot arms which are installed on the upper face of the body, extend in the first direction, are spaced apart from each other in a second direction perpendicular to the upper face of the body, and are able to grip a wafer, and an alignment jig (jig) which is installed on the upper face and side faces of the body, and senses positions of the plurality of robot arms, wherein the alignment jig includes, a horizontal frame disposed on the upper face of the body, a vertical frame disposed on the side faces of the body, and a displacement sensor installed on the horizontal frame and the vertical frame to sense coordinates of upper faces of the plurality of robot arms and side faces of the plurality of robot arms, the displacement sensor includes a first sensor and a second sensor which are spaced apart from side faces of the plurality of robot arms in a third direction perpendicular to the first and second directions and spaced apart from each other in the first direction, and an upper face of the displacement sensor is disposed at a vertical level higher than vertical levels of the upper faces of each of the plurality of robot arms.
