Samsung electronics co., ltd. (20240274581). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274581 titled 'SEMICONDUCTOR PACKAGE
The abstract of a semiconductor package patent application describes a package substrate with a first semiconductor chip containing a high-density region in its first inactive layer.
- The semiconductor package includes a package substrate and a first semiconductor chip.
- The first semiconductor chip has a first inactive layer with a high-density region.
- The high-density region in the first inactive layer has a higher density than other regions of the layer.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor packages. - It may find applications in high-performance electronic devices requiring precise semiconductor chip placement.
Problems Solved: - Provides a solution for enhancing the density and performance of semiconductor chips. - Offers a method for improving the efficiency of semiconductor package substrates.
Benefits: - Increased density in the high-density region of the first inactive layer. - Enhanced performance and efficiency of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology could be utilized in the production of cutting-edge electronic devices with superior performance and efficiency. It may have significant implications in industries such as telecommunications, computing, and consumer electronics.
Questions about Semiconductor Packaging Technology: 1. How does the high-density region in the first inactive layer impact the overall performance of the semiconductor chip? - The high-density region in the first inactive layer enhances the efficiency and density of the semiconductor chip, leading to improved performance. 2. What are the potential market opportunities for semiconductor packages incorporating this high-density region technology? - The market opportunities for semiconductor packages with this technology are vast, especially in industries requiring high-performance electronic devices.
Original Abstract Submitted
a semiconductor package includes a package substrate, and a first semiconductor chip positioned on the package substrate. the first semiconductor chip includes a first inactive layer and a first active layer. the first inactive layer includes a high-density region, and the high-density region of the first inactive layer has a higher density than densities of other regions of the first inactive layer.
