Samsung electronics co., ltd. (20240268110). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoo-Cheol Shin of Suwon-si (KR)
Young-Woo Park of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240268110 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a peripheral circuit region on a substrate, a polysilicon layer on the peripheral circuit region, a memory cell array region on the polysilicon layer and overlapping the peripheral circuit region, an upper interconnection layer on the memory cell array region, and a vertical contact through the memory cell array region and the polysilicon layer, connecting the upper interconnection layer to the peripheral circuit region.
- The innovation involves a semiconductor device design with a memory cell array region overlapping a peripheral circuit region, allowing for efficient integration of different components on a single substrate.
- The vertical contact through the memory cell array region and the polysilicon layer enables connectivity between the upper interconnection layer and the peripheral circuit region, enhancing the overall functionality of the device.
- This design optimizes space utilization and improves the performance of the semiconductor device by facilitating communication between different regions on the substrate.
- The integration of the memory cell array region and the peripheral circuit region in a stacked configuration enhances the overall efficiency and effectiveness of the semiconductor device.
- The vertical contact serves as a crucial element in ensuring seamless connectivity and data transfer within the semiconductor device.
Potential Applications: - This technology can be applied in the development of advanced memory devices with enhanced performance capabilities. - It can be utilized in the production of high-density integrated circuits for various electronic devices. - The design can find applications in the manufacturing of efficient semiconductor components for consumer electronics, automotive systems, and industrial equipment.
Problems Solved: - Efficient integration of different regions on a semiconductor substrate. - Enhanced connectivity and communication between memory cell array and peripheral circuit regions. - Optimization of space utilization and performance in semiconductor devices.
Benefits: - Improved functionality and performance of semiconductor devices. - Enhanced efficiency in data transfer and connectivity within the device. - Space-saving design for compact electronic devices with advanced capabilities.
Commercial Applications: Title: Advanced Semiconductor Device Design for Enhanced Performance This technology has significant commercial potential in the semiconductor industry, particularly in the development of memory devices, integrated circuits, and electronic components for various applications. The innovative design offers improved efficiency, performance, and connectivity, making it a valuable asset for manufacturers looking to enhance their product offerings in the market.
Questions about the technology: 1. How does the vertical contact in the semiconductor device contribute to its overall functionality? 2. What are the key advantages of integrating the memory cell array region with the peripheral circuit region in a stacked configuration?
Original Abstract Submitted
a semiconductor device includes a peripheral circuit region on a substrate, a polysilicon layer on the peripheral circuit region, a memory cell array region on the polysilicon layer and overlapping the peripheral circuit region, the peripheral circuit region being under the memory cell array region, an upper interconnection layer on the memory cell array region, and a vertical contact through the memory cell array region and the polysilicon layer, the vertical contact connecting the upper interconnection layer to the peripheral circuit region.
