Samsung electronics co., ltd. (20240266716). ELECTRONIC DEVICE INCLUDING ANTENNA simplified abstract
Contents
ELECTRONIC DEVICE INCLUDING ANTENNA
Organization Name
Inventor(s)
Kwanghyun Baek of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING ANTENNA - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266716 titled 'ELECTRONIC DEVICE INCLUDING ANTENNA
The abstract describes a radio unit module consisting of a first substrate with a radio frequency integrated circuit (RFIC), a second substrate with multiple layers including antenna elements, and conductivity members.
- The radio unit module includes a first substrate with a RFIC and a second substrate with antenna elements and conductivity members.
- The RFIC is connected to the first surface of the first substrate.
- The second substrate is attached to the second surface of the first substrate.
- Antenna elements are located on the layers of the second substrate.
- Conductivity members are spread across the layers of the second substrate.
Potential Applications: - Wireless communication devices - IoT devices - Satellite communication systems
Problems Solved: - Efficient radio frequency signal transmission - Compact design for space-constrained applications
Benefits: - Improved signal quality - Enhanced connectivity - Space-saving design
Commercial Applications: Title: Advanced Radio Unit Modules for Wireless Communication Devices This technology can be used in the development of high-performance wireless communication devices, IoT systems, and satellite communication systems. The compact design and improved signal quality make it ideal for various commercial applications in the telecommunications industry.
Questions about Radio Unit Modules: 1. How does the integration of antenna elements on multiple layers of the second substrate improve signal transmission? 2. What are the key advantages of using conductivity members across the layers of the second substrate in a radio unit module?
Original Abstract Submitted
a radio unit (ru) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (rfic); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. the rfic may be coupled to the first surface of the first substrate. the second substrate may be coupled to the second surface of the first substrate. the plurality of antenna elements may be disposed on the at least one first layer of the second substrate. the plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
