Samsung electronics co., ltd. (20240266309). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Atsushi Fujisaki of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266309 titled 'SEMICONDUCTOR DEVICE
The semiconductor package described in the patent application includes a semiconductor chip, a redistribution layer structure, a bump pad, a metal seed layer, an insulating layer, and a bump structure.
- The bump pad has an upper structure of a first width and a lower structure of a second width less than the first width.
- The metal seed layer is disposed along the lower surface of the upper structure and a side surface of the lower structure.
- Undercuts are present at both ends of the metal seed layer where it contacts the upper and lower structures.
- The insulating layer surrounds the redistribution layer structure and the bump pad.
- The bump structure is located under the bump pad.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the electrical connectivity and thermal management of semiconductor packages. - Provides a more efficient and reliable way to integrate semiconductor chips into electronic devices.
Benefits: - Improved electrical performance and thermal dissipation. - Enhanced reliability and durability of semiconductor packages. - Enables the production of smaller and more compact electronic devices.
Commercial Applications: - This technology has significant commercial potential in the semiconductor industry, particularly in the development of high-performance electronic devices. - It can be utilized by semiconductor manufacturers, electronics companies, and research institutions to enhance their product offerings and technological capabilities.
Questions about the technology: 1. How does the design of the bump pad contribute to the overall performance of the semiconductor package? 2. What are the specific advantages of the metal seed layer in this semiconductor packaging technology?
Original Abstract Submitted
a semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a second width less than the first width, a metal seed layer disposed along a lower surface of the upper structure and a side surface of the lower structure, an insulating layer surrounding the redistribution layer structure and the bump pad, and a bump structure disposed under the bump pad. a first undercut is disposed at one end of the metal seed layer that contacts the upper structure, and a second undercut is disposed at an other end of the metal seed layer that contacts the lower
