Samsung electronics co., ltd. (20240266269). SEMICONDUCTOR PACKAGE DEVICE simplified abstract
Contents
SEMICONDUCTOR PACKAGE DEVICE
Organization Name
Inventor(s)
CHANGEUN Joo of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266269 titled 'SEMICONDUCTOR PACKAGE DEVICE
The semiconductor package device described in the abstract includes a semiconductor chip with first and second chip pads on its active surface, as well as a redistribution substrate on these chip pads. The redistribution substrate consists of first and second redistribution patterns stacked on the active surface, with the first pattern including a first via part and a first via pad part vertically overlapping the first via part, and the second pattern including a second via part and a second via pad part vertically overlapping the second via part. The first via part contacts the first chip pad, while the second via part contacts the second chip pad, with the length of the second via part being greater than that of the first via part.
- Semiconductor package device with redistribution substrate
- First and second chip pads on semiconductor chip
- First and second redistribution patterns on active surface
- Vertical overlapping of via parts and via pad parts
- Contact between via parts and chip pads
- Greater length of second via part compared to first via part
Potential Applications: - Advanced semiconductor packaging technology - High-density integrated circuits - Miniaturized electronic devices
Problems Solved: - Improved signal transmission efficiency - Enhanced electrical connectivity - Space-saving design for semiconductor packages
Benefits: - Higher performance in semiconductor devices - Increased reliability in electronic systems - Cost-effective manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology can be utilized in the production of smartphones, tablets, laptops, and other consumer electronics where compact size and high performance are essential. It can also find applications in automotive electronics, medical devices, and industrial equipment.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor packaging methods, redistribution substrates, and advanced chip pad designs in the field of microelectronics.
Frequently Updated Research: Researchers are constantly working on enhancing the design and performance of semiconductor package devices, including exploring new materials for redistribution substrates, optimizing via pad configurations, and improving signal integrity in high-speed electronic systems.
Questions about Semiconductor Package Devices: 1. How does the length of the via parts impact the performance of the semiconductor package device? The length of the via parts affects the electrical connectivity and signal transmission efficiency within the device. A longer via part can provide better contact between the chip pads and the redistribution patterns, leading to improved performance.
2. What are the key considerations in designing efficient redistribution substrates for semiconductor package devices? Efficient redistribution substrates should prioritize signal integrity, electrical connectivity, and space-saving design to enhance the overall performance of the semiconductor package device.
Original Abstract Submitted
disclosed is a semiconductor package device comprising a semiconductor chip including first and second chip pads on an active surface of the semiconductor chip, and a redistribution substrate on the first and second chip pads. the redistribution substrate includes first and second redistribution patterns sequentially stacked on the active surface. the first redistribution pattern includes a first via part and a first via pad part vertically overlapping the first via part. the second redistribution pattern includes a second via part and a second via pad part vertically overlapping the second via part. the first via part contacts the first chip pad. the second via part contacts the second chip pad. a length of the second via part is greater than that of the first via part.
