Samsung electronics co., ltd. (20240266248). SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract
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SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE
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SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266248 titled 'SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE
Simplified Explanation: The semiconductor package described in the patent application includes a solid-state drive (SSD) device with a printed circuit board, memory packages, and dummy packages. The dummy packages help dissipate heat from the printed circuit board.
- The semiconductor package contains a solid-state drive (SSD) device with a printed circuit board, memory packages, and dummy packages.
- The dummy packages are electrically coupled with the printed circuit board and include a first pad that dissipates heat from the board.
- The dummy packages help in managing the heat generated by the printed circuit board.
Key Features and Innovation:
- Inclusion of dummy packages in a semiconductor package to dissipate heat.
- Electrically coupling the dummy packages with the printed circuit board.
- Utilizing a first pad in the dummy packages as a heat dissipation mechanism.
Potential Applications: The technology can be used in various electronic devices that require efficient heat dissipation, such as laptops, desktop computers, and servers.
Problems Solved: The technology addresses the issue of heat management in semiconductor packages, ensuring optimal performance and longevity of electronic devices.
Benefits:
- Improved heat dissipation in semiconductor packages.
- Enhanced performance and reliability of electronic devices.
- Extended lifespan of electronic components.
Commercial Applications: Potential commercial applications include the manufacturing of laptops, desktop computers, servers, and other electronic devices that require efficient heat management for optimal performance.
Questions about Semiconductor Packages with Dummy Packages: 1. How do dummy packages help dissipate heat in semiconductor packages? 2. What are the potential benefits of using dummy packages in electronic devices?
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Original Abstract Submitted
the present disclosure provides semiconductor packages including dummy packages. in some embodiments, the semiconductor package includes a solid-state drive (ssd) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. the at least one dummy package is electrically coupled with the printed circuit board. the at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.
