Samsung electronics co., ltd. (20240258242). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258242 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package body, a fan-in-chip structure (FICS) within the package body, a first redistribution structure, and a second redistribution structure. The FICS includes a first chip with a front surface and a rear surface, a bridge wiring structure on the rear surface of the first chip, and a bridge pad connected to the bridge wiring layer. The first redistribution structure is located on the bottom surface of the package body and the front surface of the first chip, containing a first redistribution element. The second redistribution structure is on the top surface of the package body and the rear surface of the first chip, with a second redistribution element connected to the bridge wiring structure.
- The semiconductor package includes a fan-in-chip structure (FICS) with a bridge wiring structure and bridge pad.
- There are two redistribution structures, one on the bottom surface and the front surface of the first chip, and the other on the top surface and the rear surface of the first chip.
- The first redistribution structure contains a first redistribution element, while the second redistribution structure includes a second redistribution element connected to the bridge wiring structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of integrated circuits in compact electronic devices.
Problems Solved: - Enhances the electrical connectivity and signal transmission within semiconductor packages. - Optimizes the layout and design of semiconductor components for better functionality.
Benefits: - Improved efficiency and performance of semiconductor packages. - Enhanced reliability and durability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and laptops. It can also benefit industries like telecommunications, automotive, and aerospace.
Questions about Semiconductor Packaging Technology: 1. How does the FICS structure improve the performance of semiconductor packages? - The FICS structure enhances electrical connectivity and signal transmission within the semiconductor package, leading to improved performance and reliability.
2. What are the key advantages of having two redistribution structures in the semiconductor package? - Having two redistribution structures allows for optimized layout and design of semiconductor components, leading to better functionality and performance.
Original Abstract Submitted
a semiconductor package includes a package body, a fan-in-chip structure (fics) in the package body, a first redistribution structure, and a second redistribution structure. the fics includes a first chip having a front surface and a rear surface, a bridge wiring structure including a bridge wiring layer on the rear surface of the first chip, and a bridge pad electrically connected to the bridge wiring layer. the first redistribution structure is on a bottom surface of the package body and the front surface of the first chip and includes a first redistribution element. the second redistribution structure is on a top surface of the package body and the rear surface of the first chip and includes a second redistribution element electrically connected to the bridge wiring structure.
