Samsung electronics co., ltd. (20240258228). INTEGRATED CIRCUIT DEVICE simplified abstract

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INTEGRATED CIRCUIT DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Juneyoung Park of Suwon-si (KR)

Heonjong Shin of Suwon-si (KR)

Jaeran Jang of Suwon-si (KR)

Doohyun Lee of Suwon-si (KR)

INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258228 titled 'INTEGRATED CIRCUIT DEVICE

The integrated circuit device described in the patent application includes a first substrate with an active device, a beol structure for signal routing, a second substrate with a passive device, a power distribution structure, and bonding structures.

  • The device has a first substrate with active devices and a second substrate with passive devices.
  • A beol structure is used for signal routing on the first substrate.
  • A power distribution structure is located on the second surface of the first substrate.
  • Bonding structures are positioned between the first substrate and the second substrate.

Potential Applications: - This technology can be used in the development of advanced integrated circuits for various electronic devices. - It can enhance the performance and efficiency of semiconductor devices in applications such as telecommunications, computing, and consumer electronics.

Problems Solved: - The technology addresses the need for improved signal routing and power distribution in integrated circuits. - It provides a solution for integrating active and passive devices on different substrates.

Benefits: - Improved signal routing efficiency and power distribution in integrated circuits. - Enhanced performance and functionality of electronic devices. - Increased flexibility in designing complex semiconductor devices.

Commercial Applications: Title: Advanced Integrated Circuit Technology for Enhanced Performance This technology can be applied in the development of high-performance electronic devices, leading to improved functionality and efficiency. It has significant implications for the semiconductor industry, enabling the creation of more advanced and versatile integrated circuits.

Questions about Integrated Circuit Device Technology: 1. How does this technology improve signal routing efficiency in integrated circuits? 2. What are the potential applications of integrating active and passive devices on different substrates?


Original Abstract Submitted

an integrated circuit device includes a first substrate having a first surface and a second surface opposite to the first surface, and including an active device therein, beol structure disposed on the first surface of the first substrate and configured to route signals, a second substrate disposed on the first surface of the first substrate with the first beol structure disposed therebetween, and including a passive device therein, a power distribution structure disposed on the second surface of the first substrate, a first bonding structure positioned on the first beol structure, and a second bonding structure disposed between the first bonding structure and the second substrate.