Samsung electronics co., ltd. (20240250100). IMAGE SENSOR PACKAGE simplified abstract
Contents
IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250100 titled 'IMAGE SENSOR PACKAGE
The abstract describes an image sensor package that includes an image sensor chip with a central sensing area and an outer area, a transparent substrate covering the chip, a bonding structure between the chip and substrate, and a package substrate for mounting and connecting the chip.
- Image sensor chip with central sensing area and outer area
- Transparent substrate covering the image sensor chip
- Bonding structure between the chip and substrate
- Package substrate for mounting and connecting the chip
- Photo absorption layer enclosing the edge of the sensing area
Potential Applications: - Digital cameras - Smartphones - Surveillance systems - Medical imaging devices
Problems Solved: - Protecting the image sensor chip - Ensuring proper electrical connection - Enhancing image quality
Benefits: - Improved image sensor performance - Enhanced durability and reliability - Compact design for various applications
Commercial Applications: - Consumer electronics industry - Security and surveillance sector - Medical imaging equipment market
Questions about Image Sensor Package: 1. How does the transparent substrate enhance the performance of the image sensor chip? 2. What are the key advantages of the bonding structure in this image sensor package design?
Frequently Updated Research: - Ongoing advancements in image sensor technology - Research on improving image quality and sensor efficiency
Original Abstract Submitted
an image sensor package according to an embodiment includes: an image sensor chip having a sensing area of a central part and an outer area surrounding the sensing area; a transparent substrate spaced apart from and above the image sensor chip and covering the image sensor chip; a bonding structure disposed between the image sensor chip and the transparent substrate and provided on an upper surface of the outer area; and a package substrate on which the image sensor chip is mounted and electrically connected to the image sensor chip, wherein the image sensor chip, on a plane, includes a photo absorption layer enclosing the edge of the sensing area and having a pattern protruded toward the bonding structure along a circumference.
